ITES China Shenzhen International Industrial Manufacturing Technology and Equipment Exhibition
Company Introduce
Fastprint (Stock Code: 002436) has been deeply rooted in the electronic circuit industry for more than three decades, establishing itself as a global leading digitalised manufacturing provider of advanced electronic circuit solutions. We possess core technologies and mass-production capabilities in electronic circuit manufacturing, with product portfolio spanning the entire three-level packaging of advanced electronics, i.e. Board Level, Module Level, and Chip Level. As a pioneer in digital design and manufacturing operation model, we are able to offer our customers high-value end-to-end solutions, from design to production to testing and final delivery. Fastprint actively collaborates with our partners to drive technology iteration. We continuously refine complex process technologies to meet world-class standards. Our expertise has earned the long-term trust of major global customers across diverse sectors, including communications, data centers, aerospace, industrial control, medical devices and consumer electronics.
Exhibit brands
Exhibits
FCBGA package substrate
Flip Chip Ball Grid Array (FCBGA) substrate is an important carrier of high-end digital chips such as CPU, Graphics Processing Unit (GPU) and FPGA for AI, 5G, big data, high performance computing (HPC), smart cars and data centers. It has many advantages, such as high computing power, high speed, high bandwidth, low latency, low power consumption, multi-function and system-level integration. Xingsen Technology FCBGA Packaging Substrate Project, aiming at the highest leading level in China, fills the gap in the domestic semiconductor industry chain with independent core technology, and solves the bottleneck problem for the localization of high-end chips.
CSP package substrate
CSP packaging substrate products solve the independent matching of CSP packaging substrates for storage, RF and processor chip localization. After ten years of development, the CSP packaging substrate business of Xingsen Technology has accumulated a number of self-developed technological achievements, forming the first echelon production capacity of conventional packaging substrates in China.
Main products
The company has always been committed to the research and development of cutting-edge technology, mainly engaged in PCB templates and small batches of printed circuit boards, integrated circuit packaging substrates, semiconductor test boards, providing one-stop services from design to test delivery and PCBA.
