JIANGXI WELLDONE ELECTRONICS LTD.

Company Introduce

Company Profile/Company Profile Founded in 2005, Shangzheng Circuit now has production bases in Shenzhen, Jiangxi and California, USA. Shangzheng Circuit covers an area of 8000 square meters, with a building area of 10000 square meters, and an annual output of 300000 square meters of high-end metal substrates in the first phase.

Thermal Electric Copper Base

Thermoelectric separation t copper substrate: the circuit part and the thermal layer part of the substrate are on different circuit layers, and the thermal layer part is directly in contact with the heat dissipation part of the lamp bead to achieve the best heat dissipation and heat conduction (zero thermal resistance), generally copper substrate. Thermoelectric separation of copper substrate means that a production process of copper substrate is a thermoelectric separation process, in which the circuit part and the thermal layer part of the substrate are on different circuit layers, and the thermal layer part is directly in contact with the heat dissipation part of the lamp bead to achieve the best heat dissipation and heat conduction (zero thermal resistance).

Double Sided Aluminum Base

Double-sided aluminum substrate is a kind of composite material which is made of aluminum metal as the base material and double-sided copper foil and aluminum base layer laminated by epoxy resin adhesive. Its core structure is composed of a circuit layer (copper foil), a thermal insulation layer (epoxy resin substrate) and an aluminum base layer. The double-sided circuit connection is realized through the via-hole technology, and the double-sided interconnection is realized through the laser drilling and electroless copper deposition process. The diameter of the via-hole is less than or equal to 0.3mm [1]. The fabrication process consists of drilling, anodizing the aluminum substrate to form an insulating oxide film with a thickness greater than 10 μM, and press molding with a lamination process [2]. The thermal resistance of the thermal insulating layer of the material directly affects the heat dissipation efficiency of the device, and the typical parameters include a thermal conductivity of ≥ 1.0 W/m · K and a withstand voltage strength of 1000-1500 V. Compared with the traditional FR-4 material, the material can improve the power load carrying capacity by more than 60%. In 2024, the utility model patent proposed to add a heat conduction strip and a frame heat dissipation device to build a three-dimensional heat dissipation path to further improve the heat conduction efficiency. In 2021, the technical literature pointed out that the structure could reduce the thermal resistance to 1.2 ℃ · in ²/W. The test showed that the design could reduce the thermal resistance by 18%. Under the working condition of 30 W/m · K thermal conductivity, The junction temperature of the chip drops by 12 ℃ [1]. It is mainly used in high-power LED lighting modules, new energy automotive power modules and other fields. By 2025, the actual measurement of the product shows that the minimum line width spacing can reach 0.5mm, which meets the needs of complex circuit design.

Main products

High thermal conductivity integrated heat dissipation solutions and product design and manufacturing, including single-sided aluminum substrates, single-sided double-sided aluminum substrates, double-sided copper-aluminum substrates, thermoelectrically separated copper substrates, thermoelectrically separated copper-aluminum substrates, iron substrates, resin-filled hole boards, and more. By leveraging advanced technologies, we provide high heat dissipation and high voltage-resistant solutions for automotive headlights, industrial control power supplies, new energy vehicle motor control, outdoor high-power lighting, stage lighting, and other fields.